JoAnne DeBlis
Precision Pad Technology was developed to dramatically increase first pass yields at assembly. PPT improves fine pitch solderability by forming solid solder deposits on all surface mount sites on wafers, ceramics, PCBs and other rigid or flexible substrates. These provide an excellent mating surface for surface mount components and virtually eliminate solder paste related defects such as solder balls, slumping and shorts. PPT is compatible with a wide array of surface finishes including HASL, organic coatings and gold. Solder paste is ...
