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Mask Technology Inc. was formed in 1983 as the first value added service bureau in the United States dedicated to the application of Solder Masks on Printed Circuit Boards. The company’s core focus since formation has been enhancing first pass yields. While originally coating dry film solder masks, Mask Technology evolved, as did the industry, and expanded to provide services for OEM’s, CEM’s and Printed Circuit Board manufacturers.

In 1989 the company expanded into Hot Air Solder Leveling and subsequently adopted Halco Teledynes horizontal leveling process. As densities increased this technology was well suited particularly with the introduction of Ball Grid Array and Chip Scale Packages.

In addition to services provided to the bare board manufacturer, Mask Technology developed similar services designed to enhance yields in the integrated circuit, assembly and semiconductor industries. Among these are our patented Precision Pad Technology Solid Solder Deposit process in addition to ecospheres, both available in eutectic and lead-free.

Mask Tek’s services benefit those manufacturing both prototype and production runs of products that demand high reliability for applications including;

  • Automotive
  • Computer Electronics
  • Military and Defense

With a business philosophy centered on maintaining an open mind towards new and evolving technologies Mask Tek has become a focal point for companies interested in exploring the state of the art in the electronics industry.